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NeoGene Liquid Cooler
With the advancement of semiconductor technology and chip design capabilities, the computing power of the chip has been greatly improved, and the thermal design power of the single-chip is also required to increase from 300W to 500W, or even more than 1000W.
NeoGene Liquid Cooler provides a complete chip cooling solution, from 300W to 1,200W.
NeoGene Immersion Dissipator
With the advancement of semiconductor technology and chip design capabilities, the computing power of the chip has been greatly improved, and the thermal design power of the single-chip is also required to increase from 300W to 500W, or even more than 1,000W.
NeoGene Immersion Dissipator provides a complete chip cooling solution, from 300W to 1,500W.
NeoGene Package Module
In order to further reduce thermal resistance, NeoGene Tech provides IC brands a customized package level NeoGene Cooling Engine solution.
The IHS can be replaced by NeoGene Package Module. By having such module, the IC device will be able to dissipate the high power density heat by itself.
NeoGene Package Module provides a complete chip cooling capability from 500W to 2,000W.
NeoGene Tech is dedicated on developing advanced vapor chamber technologies for electronics thermal management to pursing extreme heat dissipation.
If you are interested in more detail, please feel free to contact us.
Technology Platform and Patent
NeoGene Tech have over 100+ patent innovations and proprietary technologies categorized into 4 portions covering new material、new process、new architecture and new platform.
NeoGene Cooling Engine
NeoGene Cooling Engine is a high efficient thermal module device that a proprietary 3D vapor chamber with dissipation fins coupling together.
NeoGene Liquid Cooler and NeoGene Immersion Dissipator are product series developed based on NeoGene Cooling Engine, which can be used in cooling semiconductor chips in high-performance computing, such as CPU/GPU, data center and cloud computing and IGBTs.