For A Better 5G Computing World
MagicWick-inside Slim Heat Pipe Plate technology dramatically reduces the core temperature of CPUs and GPUs.
Hot spots generated by microprocessors can be insulted for low skin temperature and better user experience.
Computing speed is fully liberated. Higher throttling clock frequency. Fewer shut down cores.
Thermal components working concurrently to liberate, Insulate, conduct and dissipate the heat more efficiently.
LICD Thermal Solution is so effective to improve both the life of system and battery
Print wick structuring enables the slim heat pipe plate fabricated in low cost high yield rate and mass production
Concurrent LICD Solution for Your 5G Computing Platform
NeoGene Tech provides thermal management solutions to 5G computing supply chain from system makers to thermal component suppliers to solve their heat challenges.